▎ 摘　　要

The good interface bonding is the basic requirement of metal-graphene composites to improve their mechanical properties. Here, we fabricated the hybrid composites through traditional powder metallurgy method. SEM and XRD were conducted to elaborate the microstructure and crystal orientation of powder as well as bulk composites. Tensile and hardness test was carried out to check the effect of graphene on copper-titanium carbide composite. Titanium carbide/copper-graphene (0.1 wt%) composite have excellent yield strength, ultimate strength and hardness higher than pure copper and also from copper-titanium carbide composite. The thermal conductivity values and anisotropic thermal conductivity ratio of titanium carbide/copper-graphene (0.1 wt%) composite are also far better than pure Cu. The results of mechanical and thermal properties demonstrate that these materials can be a better candidate to use in the thermal packaging system.