• 文献标题:   Adhesion improvement of graphene/copper interface using UV/ozone treatments
  • 文献类型:   Article, Proceedings Paper
  • 作  者:   SEO J, CHANG WS, KIM TS
  • 作者关键词:   graphene, copper, adhesion, interface, uv/ozone treatment
  • 出版物名称:   THIN SOLID FILMS
  • ISSN:   0040-6090
  • 通讯作者地址:   Korea Adv Inst Sci Technol
  • 被引频次:   14
  • DOI:   10.1016/j.tsf.2015.01.007
  • 出版年:   2015

▎ 摘  要

The weak adhesion between graphene and its substrate is a potentially significant problem for graphene-based electronic devices. However, quantitative studies on adhesion improvement between graphene and its substrate using simple surface treatments have not yet been reported. In this study, we report the adhesion improvement of the graphene/copper interface using a UV/ozone treatment. The adhesion energy is measured directly using double cantilever beam fracture mechanics testing. A significantly improved adhesion energy of 2.10 +/- 0.27 J/m(2) is achieved with 15 min of UV/ozone treatment; the improved adhesion energy is approximately 200% of that without treatment. The chemical modification of the graphene/copper interface is also characterized using X-ray photoemission spectroscopy (XPS). (C) 2015 Elsevier B.V. All rights reserved.