• 文献标题:   Thermal Characterization of Multi-Layer Graphene Heat Spreader by Pt/Cu/Ti Micro-Coil
  • 文献类型:   Article
  • 作  者:   ABDULLAH MF, NAZIM NJNB, SORIADI N, BADARUDDIN SAM, HUSSIN MRM, SYONO MI
  • 作者关键词:   heat spreader, multilayer graphene, pt, cu, ti microcoil, thermal hotspot
  • 出版物名称:   PHYSICA STATUS SOLIDI AAPPLICATIONS MATERIALS SCIENCE
  • ISSN:   1862-6300 EI 1862-6319
  • 通讯作者地址:  
  • 被引频次:   8
  • DOI:   10.1002/pssa.202100301 EA OCT 2021
  • 出版年:   2021

▎ 摘  要

Hotspot cooling by heat spreader is essential to avoid reliability issues of the power electronic devices. Herein, the evaluation of the heat spreading capability of mono- and multi-layer graphene using a Pt/Cu/Ti micro-coil heater-thermometer is reported. Monolayer graphene is grown and transferred onto the test structure which consists of micro-coil, pads, and heat sinks. The temperature coefficient of resistance of the bare coil is around 0.0087 degrees C-1. During Joule heating, the bare structure dissipates heat from the coil mainly via stage. Deposited graphene helps carry heat from the coil to the peripheral heat sinks. In transient-state Joule heating, graphene reduced all stage, coil, and hotspot temperatures. However, stage temperature cannot be reduced during steady-state Joule heating. The thickening of the graphene layer did improve the heat dissipation from the coil. The optimum number of layers is suggested to be 3-layers graphene with a hotspot reduction from 5.86 degrees C W-1 down to 4.97 degrees C W-1. More than 3-layers result in a slight increase in hotspot temperature due to heat accumulation within the films. Findings in this work give insight into thermal management strategies in high-temperature power electronics.