▎ 摘　　要

Materials with adjustable wide-ranging thermal conductivity are desired to tackle the problem of ther-mal management for electronic devices operating in an extended range of temperature. In this study, gra-phene aerogels (GAs) are fabricated and transformed from thermal insulators to thermal conductors by high-temperature annealing. The highest through-plane and in-plane thermal conductivity of annealed GA reaches 3.3 and 96 W/m center dot K, respectively, under 95% compressive strain. Using the annealed GA as ther-mal interface material leads to superior performance than commercially available products that have higher through-plane thermal conductivity in dissipating heat for high-power electronic devices (e.g., LED lamp). Furthermore, due to excellent elasticity, the thermal resistance of annealed GAs can be rever-sibly tuned about six-fold by compressive strain. This paves a novel venue in designing thermal manage-ment system for devices, which not only need excellent heat dissipation but also good thermal insulation at various operating environments.(c) 2022 Elsevier Inc. All rights reserved.