• 文献标题:   Temperature Coefficient of Resistance in Graphene-Coated Cu from First Principles
  • 文献类型:   Article
  • 作  者:   AHMED M, LI YJ, LI EP
  • 作者关键词:  
  • 出版物名称:   ECS JOURNAL OF SOLID STATE SCIENCE TECHNOLOGY
  • ISSN:   2162-8769
  • 通讯作者地址:   Hebei Univ Technol
  • 被引频次:   0
  • DOI:   10.1149/2.0221811jss
  • 出版年:   2018

▎ 摘  要

We report an investigation of electrical and thermal characteristics of graphene-coated copper. The I-V characteristics and the temperature coefficient of resistance (TCR) are calculated based on first-principles simulation. A single layer of graphene helps to enhance the transport properties of copper due to the weak bonding between copper and graphene as confirmed by the band structure calculations. Projected density of states (PDOS) at the interface between copper and graphene show that graphene contributes to the total density of states at Fermi level. The results demonstrate graphene as a coating barrier to reduce the electrical resistance and the TCR. In addition, the current capability of the Cu is increased by 84.16%. (C) 2018 The Electrochemical Society.