▎ 摘　　要

Effective heat dissipation needed for traditional light-emitting diodes (LEDs) is somewhat difficult because the heat sources are typically encapsulated in silicone and plastic cavities with low thermal conductivities. This article demonstrates a novel packaging design to direct ink print a high thermal conductivity three-dimensional (3D) kaolin/graphene (rGO) suspension (KGS) cavity on direct plated copper (3DPC) ceramic substrate, which applies to improve high-power LEDs heat dissipation. With the modification with titanate coupling agent (TCA), rGO-TCA facilitates interface compatibility between rGO and geopolymer, which, in turn, eliminates microdefects in matrix. Efficient heat transfer channels formed by the combination of the silicone-free structure and cured KGS cavities on 3DPC LEDs, this benefits overall heat dissipation. At the current of 650 mA, the surface temperature of LEDs is reduced about 20 degrees C, and the 3DPC module for white LED lighting still maintains a color rendering index of 71.4 and a neutral white color temperature of 5381 K, indicating that this research innovates a new class of packaged structure, simplified process and materials with promising possibility in a variety of semiconductor devices. (C) 2019 Elsevier B.V. All rights reserved.