▎ 摘　　要

To enhance the mechanical reliability without sacrificing the electrical conductivity of the flexible electronics, in this work submicmn-thick Cu/Au/PI (CAP) and graphene/Cu/Au/PI (GCAP) films were fabricated successfully by using a series of assembly methods through introducing a graphene passivation layer onto the polyimide (PI)-supported Cu film surface, and a nanoscale gold (Au) interlayer between the Cu/PI interface. Tensile testing results reveal that the yield strength, the fracture strain and the electrical properties of the GCAP film were improved simultaneously. Furthermore, the GCAP film also exhibited a higher fatigue strength than the CAP film. The basic mechanism is mainly attributed to the effective suppression of the Cu/graphene interface on the fatigue extrusion formation through constraining dislocation motion.