▎ 摘　　要

Thermal management has become a critical aspect in next-generation miniaturized electronic devices. Efficient heat dissipation reduces their operating temperatures and insures optimal performance, service life, and efficacy. Shielding against shocks, vibrations, and moisture is also imperative when the electronic circuits are located outdoors. Potting (or encapsulating) them in polymer-based composites with enhanced thermal conductivity (TC) may provide a solution for both thermal management and shielding challenges. In the current study, graphene is employed as a filler to fabricate composites with isotropic ultrahigh TC (>12 W m(-1) K-1) and good mechanical properties (>30 MPa flexural and compressive strength). To avoid short-circuiting the electronic assemblies, a dispersion of secondary ceramic-based filler reduces the electrical conductivity and synergistically enhances the TC of composites. When utilized as potting materials, these novel hybrid composites effectively dissipate the heat from electronic devices; their operating temperatures decrease from 110 to 37 degrees C, and their effective thermal resistances are drastically reduced, by up to 90%. The simple filler dispersion method and the precise manipulation of the composite transport properties via hybrid filling offer a universal approach to the large-scale production of novel materials for thermal management and other applications.