▎ 摘　　要

As an indispensable part of electronic devices, efficient thermal management materials can promote heat dissipation of electronic products quickly, thereby greatly improving their reliability, stability and service life. Here, a simple "in-situ building" approach was developed to fabricate highly thermally conducive polypropylene (PP)/graphene composites with three-dimensional graphene framework. Different from conventional filler modification, a unique matrix functionalization method, inspired by mussel, was carried out to form the interaction (hydrogen bonding and pi-pi conjugate) between PP and graphene, which greatly reduced interfacial thermal resistance. The obtained composite exhibits a quite high through-plane thermal conductivity (10.93 W.m(-1).K-1 , almost 55 times higher than that of pure PP), and shows excellent heat dissipation when used as a thermal management material in LED integration. The composite has the potential application in heat dissipation of high power and highly integrated electronic devices.