• 文献标题:   A 61.2-dB omega, 100 Gb/s Ultra-Low Noise Graphene TIA over D-Band Performance for 5G Optical Front-End Receiver
  • 文献类型:   Article
  • 作  者:   GORRE P, VIGNESH R, SONG HJ, KUMAR S
  • 作者关键词:   transimpedance amplifier tia, 5g backhaul, graphene fet gfet, dband, optical communication, terahertz thz
  • 出版物名称:   JOURNAL OF INFRARED MILLIMETER TERAHERTZ WAVES
  • ISSN:   1866-6892 EI 1866-6906
  • 通讯作者地址:  
  • 被引频次:   2
  • DOI:   10.1007/s10762-021-00771-0 EA JAN 2021
  • 出版年:   2021

▎ 摘  要

This work reports in first time a 100-Gb/s, ultra-low noise, variable gain multi-stagger tuned transimpedance amplifier (VGMST-TIA) over the D-band performance. The whole work is binding into two phases. The first phase involves the modeling and characterization of graphene field-effect transistor (GFET) with an optimized transition frequency of operation. While in the second phase, a TIA design employs a T-shaped symmetrical L-R network at the input, which mitigates the effect of photo diode capacitance and achieves a D-band of operation. The proposed work uses a VGMST to establish TIA, which realizes optimum noise performance. The high gain 3-stage VGMST-TIA effectively minimizes the white noise and illustrates a sharp out-of-band roll-off to achieve considerable noise reduction at high frequencies. The active feedback mechanism controls the transimpedance gain by tuning the control voltage which results better group delay. Besides, an L-C circuit is employed at the output to enhance bandwidth. The full TIA is implemented and fabricated using a commercial nano-manufacturing 9-nm graphene film FET on a silicon wafer using 0.065-mu m process. The TIA achieves a flat transimpedance gain of 61.2 dB omega with +/- 9 ps group delay variation over the entire bandwidth. The proposed TIA measured an impedance bandwidth of 0.2 THz with ultra-low input-referred noise current density of 2.03 pA/root Hz. The TIA supports a 100-Gb/s data transmission due to large bandwidth; therefore, a bit-error-rate (BER) less than 10(-12) is achieved. The chip occupies an area of 0.92 * 1.34 mm(2) while consuming power of 21 mW under supply of 1.8 V.