▎ 摘　　要

To meet the increasing demands for effective heat management of electronic devices, a graphene-based polymeric composite is considered to be one of the candidate materials owing to the ultrahigh thermal conductivity (TC) of graphene. However, poor graphene dispersion, low quality of exfoliated graphene, and strong phonon scattering at the graphene/matrix interface restrict the heat dissipation ability of graphene-filled composites. Here, a facile and versatile approach to bond graphene foam (GF) with polydimethylsiloxane (PDMS) is proposed, and the corresponding composite with considerable improvement in TC and insulativity is fabricated. First, three-dimensional GF was coated with polydopamine (PDA) via pi-pi stack and functional groups from PDA reacted with 3-aminopropyltriethoxysilane (APTS). Then, the modified GF was compressed (c-GF) to enhance density and infiltrated with PDMS to get the c-GF/PDA/APTS/PDMS composite. As a result, these processes endow the composite with high TC of in-plane 28.77 W m(-1) K-1 and out-of-plane 1.62 W m(-1) K-1 at 11.62 wt % GF loading. Besides, the composite manifests obvious improvement in mechanical properties, thermal stability, and insulativity compared to neat PDMS and GF/PDMS composite. An attempt to use the composite for cooling a ceramic heater is found to be successful. Above results open a way for such composites to be applied for the heat management of electronic devices.