• 文献标题:   A novel hot embossing Graphene transfer process for flexible electronics
  • 文献类型:   Article
  • 作  者:   BALLESIO A, PARMEGGIANI M, VERNA A, FRASCELLA F, COCUZZA M, PIRRI CF, MARASSO SL
  • 作者关键词:   graphene, cvd, graphene transfer, flexible electronic, hot embossing, gfet
  • 出版物名称:   MICROELECTRONIC ENGINEERING
  • ISSN:   0167-9317 EI 1873-5568
  • 通讯作者地址:   Politecn Torino
  • 被引频次:   5
  • DOI:   10.1016/j.mee.2019.02.010
  • 出版年:   2019

▎ 摘  要

In this work a new Single Layer Graphene (SLG) transfer technique exploiting a hot embossing process was carried out. Flexible electrolyte gated Graphene Field Effect Transistors (G-FET) were fabricated and tested electrically. A polymeric transparent foil suitable for optics and flexible electronics, Cyclic Olefin Copolymer (COC) was used as flexible substrate. Raman characterization confirmed that the new Hot Embossing Graphene Transfer (HEGT) is suitable for the deposition of SLG and the fabrication of G-FETs. A Comparison with SW common transfer method was carried out and proven for G-FETs fabrication. The HEGT devices showed typical characteristics and maintained the same performances when the substrate was bent. This demonstrated that the HEGT allows for efficient transfer of high quality SLG on large area thus providing the opportunity for the exploitation on a large scale production process for flexible substrates.