▎ 摘　　要

In this work, Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05GNSs/Cu solder joints were prepared using transient liquid phase (TLP) bonding technology. The effects of graphene nanosheets (GNSs) on the interfacial reaction in Cu/Sn58Bi/Cu TLP joints have been investigated in details bonded 200 degrees C with various bonding times. The results reveal that the interfacial IMC layer in both Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05GNSs/Cu joints was developed with the increasing of soldering duration. GNSs can act as a barrier to suppress the diffusion of metal atoms, which hindered the development of interfacial reaction. In Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05GNSs/Cu solder joint, some microvoids were observed at Cu3Sn/Cu interface. Adding GNSs can decrease the number and dimension of microvoids. In summary, the addition of GNSs can be an efficacious method to improve the reliability of solder joints for 3D packaging.