▎ 摘　　要

In the recent years, significant attention has been focused in insulating electronic encapsulation materials with high thermal conductivity. We fabricated reduced graphene oxide (RGO) encapsulated h-BN hybrids (h-BN@RGO) from the thermal reduction of electrostatically assembled h-BN@GO hybrids. It is found that the addition of h-BN@RGO fillers enhances the thermal conductivity of epoxy resins while preserving the electrical insulation. The thermal conductivity achieve 3.45 W.m(-1).K-1, by adding 40 wt% h-BN@RGO, which is enhanced by 1643% compared with that of neat epoxy.