▎ 摘　　要

In this paper, we have studied the thermal stability of GNR and Cu interconnects for terahertz frequency range. The top-contact (TC) and side-contact (SC) GNR interconnects are analyzed for stability, RC-delay, and power consumption at different interconnect lengths (10 mu m50 mu m and 100 mu m and different chip operating temperatures (233 K, 300 K and 378 K). The RC-delay and power consumption are analyzed with the help of transmission line model (TLM) using 16nm PTM-HP standard CMOS model. In our analysis, we have shown that the RC-time constant for SC-GNR is similar to(3-7)x and similar to(2-6)x less than that of TC-GNR and Cu interconnects. Similarly, we have shown that the power consumption for SC-GNR is similar to(4-7)x and similar to(2-5)x less than that of TC-GNR and Cu. In terms of stability, SC-GNR interconnect is more stable at higher frequency range (>1012 Hz) compared with TC-GNR and Cu for 10 mu m interconnect length and three different chip operating temperatures.