• 文献标题:   Graphene/SiCN Thin-Film Strain Gauges Fabricated by Direct Writing
  • 文献类型:   Article
  • 作  者:   WU C, LIN F, PAN XC, ZENG YJ, CHEN GC, FU YZ, HE YP, CHEN QN, SUN DH, HAI ZY
  • 作者关键词:   direct ink writing diw, graphene, high temperature, polymerderived ceramics pdcs, thinfilm strain gauge tfsg
  • 出版物名称:   IEEE SENSORS JOURNAL
  • ISSN:   1530-437X EI 1558-1748
  • 通讯作者地址:  
  • 被引频次:   0
  • DOI:   10.1109/JSEN.2022.3222205
  • 出版年:   2022

▎ 摘  要

The in situ strain/stress detection of hot components in harsh environments remains a challenging task. In this study, graphene/SiCN (G-SiCN) thin-film strain gauges (TFSGs) were fabricated on alumina substrates by direct ink writing (DIW). The percolation model and the piezoresistive effect of G-SiCN composites were systematically studied. On this basis, a TFSG with high conductivity (0.1 S/cm) and high sensitivity (gauge factor (GF) 9.9) of ceramic matrix conductive composites was fabricated. The graphene/SiCN TFSG has excellent static and dynamic strain response at room temperature. Subsequently, the strain dynamic test was conducted at 400 degrees C, and there was no attenuation of the GF, so as to verify the high-temperature performance of the G-SiCN TFSG. Therefore, G-SiCN TFSGs provide an effective approach for the measurement of the in situ static and dynamic strain of hot components in high-temperature environments.