• 文献标题:   Enhanced properties of UPE/ESOA partially bio-nanocomposites reinforced with chitosan functionalized graphene nanoplatelets: an innovative approach
  • 文献类型:   Article
  • 作  者:   PANDA S, BEHERA D, RATH P, BASTIA TK
  • 作者关键词:   nanocomposite, reinforcement, mechanical propertie, thermal propertie
  • 出版物名称:   BULLETIN OF MATERIALS SCIENCE
  • ISSN:   0250-4707 EI 0973-7669
  • 通讯作者地址:   KIIT Univ
  • 被引频次:   1
  • DOI:   10.1007/s12034-018-1622-2
  • 出版年:   2018

▎ 摘  要

The current study deals with the successful development of chitosan-functionalized graphene nanoplatelets (CS/GNPs) and their dispersion in the unsaturated polyester (UPE)/epoxidized soybean oil acrylate (ESOA) (80:20 w/w) blend system in different compositions of 0.3, 0.5 and 0.7 wt%. The resulting nanocomposite mixture was achieved by simple sonication method and pressed into a mould for fabrication of nanocomposite. The whole functionalization and nanocomposite preparation procedure were successfully tracked by FTIR, SEM and TEM. Nanocomposite with 0.5 wt% of CS/GNPs nanofiller has demonstrated it as the better candidate due to its optimum properties. Again for better comparison, a nanocomposite with 0.5 wt% raw GNPs was also fabricated and its properties were studied in detail. This relative study reported lower mechanical, dynamic mechanical, thermal and electrical conductivity values for 0.5 wt% raw GNPs than the corresponding CS/GNPs nanofiller-filled nanocomposites. Nanocomposite with 0.5 wt% CS/GNPs showed dramatic enhancement in mechanical, dynamic mechanical, thermal and electrical properties as well as reduced corrosion and swelling performance owing to the homogeneous distribution of nanofiller in the blend. Again, the nanocomposite showed the highest thermal and electrical conductivities with the best dielectric strength. Thus, the prepared nanocomposites with optimum nanofiller content might serve as partially biodegradable nanomaterial for applications in nanotechnology engineering, thermal applications, such as circuit boards and electrical applications, such as electronic packaging components, electromechanical devices and electric energy storage devices. This nanocomposite can also find their applications in different corrosive- and solvent-based environments.