▎ 摘　　要

Heat sink materials with superior thermal conductivity and excellent mechanical strength with low cost, are desirable for electronic packaging and thermal management in electronic and electrical engineering systems. In this work, the graphene paper (GP)/copper (Cu) composites were prepared by using a vacuum hot pressing. A zebra skin structure was constructed for improving the thermal transportation performance of GP/Cu composites. In virtue to its unique zebra skin structure, the ultrahigh thermal conductivity of 968 W m-1 K-1 was achieved for the GP/Cu composite at 70 vol% graphene loading. Furthermore, the GP/Cu composite retains high flexural strength (88 MPa) due to the good interface compatibility between the surface chemical treated GP and Cu paper. Our work provides a new method to significantly improve the in-plane thermal conductivity of thermal management materials.