• 专利标题:   Double-component addition type heat-conducting silica gel useful for radiating light-emitting diode lighting chip comprises base silicone oil, catalyst, thermally conductive filler, reinforcing and toughening additives, hydrogen-containing silicone oil, inhibitor, and graphene.
  • 专利号:   CN113444487-A
  • 发明人:   CAO Y, CHEN W
  • 专利权人:   UNIV ZHEJIANG SHANDONG IND TECHNOLOGY RE
  • 国际专利分类:   C09J011/04, C09J183/05, C09J183/07, F21V029/85, F21Y115/10
  • 专利详细信息:   CN113444487-A 28 Sep 2021 C09J-183/07 202102 Chinese
  • 申请详细信息:   CN113444487-A CN10961655 14 Sep 2020
  • 优先权号:   CN10961655

▎ 摘  要

NOVELTY - Double-component addition type heat-conducting silica gel comprises e.g. 50-60 pts. wt. base silicone oil, 3-20 pts. wt. catalyst, 80-110 pts. wt. thermally conductive filler A, and 0.1-3 pts. wt. reinforcing and toughening additives as first component, and 8-13 pts. wt. hydrogen-containing silicone oil, 1-15 pts. wt. inhibitor, 30-60 pts. wt. thermally conductive filler B, and 0.1-3 pts. wt. graphene as second component, where the concentration of the inhibitor is 10-30 wt.% catalyst. The base silicone oil is a double-end vinyl silicone oil, where the vinyl content of the double-end vinyl silicone oil is 0.1-1.5%, and the viscosity is 200-800 mPa.s. The hydrogen content in the hydrogen-containing silicone oil is 0.03-0.35%, and the viscosity is 100-300 mPa.s. The catalyst is a platinum catalyst. The inhibitor is a dimethyl silicone oil solution of ethynylcyclohexanol, where the concentration of ethynylcyclohexanol is 5-15 wt.%. USE - The double-component addition type heat-conducting silica gel is useful for radiating light-emitting diode lighting chip. ADVANTAGE - The silica gel: has good heat conductivity coefficient, suitable viscosity, good mechanical performance and good curing effect. DETAILED DESCRIPTION - Double-component addition type heat-conducting silica gel comprises 50-60 pts. wt. base silicone oil, 3-20 pts. wt. catalyst, 80-110 pts. wt. thermally conductive filler A, and 0.1-3 pts. wt. reinforcing and toughening additives as first component, and 8-13 pts. wt. hydrogen-containing silicone oil, 1-15 pts. wt. inhibitor, 30-60 pts. wt. thermally conductive filler B, and 0.1-3 pts. wt. graphene as second component, where the concentration of the inhibitor is 10-30 wt.% catalyst. The base silicone oil is a double-end vinyl silicone oil, where the vinyl content of the double-end vinyl silicone oil is 0.1-1.5%, and the viscosity is 200-800 mPa.s. The hydrogen content in the hydrogen-containing silicone oil is 0.03-0.35%, and the viscosity is 100-300 mPa.s. The catalyst is a platinum catalyst. The inhibitor is a dimethyl silicone oil solution of ethynylcyclohexanol, where the concentration of ethynylcyclohexanol is 5-15 wt.%. The reinforcing and toughening additives are white carbon black, phenyl vinyl silicone oil, and/or vinyl MQ silicone resin. The thermally conductive fillers A and B are both composed of alumina and copper powder, and the mass ratio of alumina and copper powder is 2-3:1.