▎ 摘　　要

NOVELTY - The film (46) has a vertical graphene film body (461) extended through a spiral line in a vertical plane along first direction. Heat conducting paste and/or heat conducting liquid (463) is coated on an end face of the vertical graphene film body along the first direction. The heat-conducting paste is formed as heat-conducting gel or heat-conducting silicon grease. The heat conducting liquid is formed as lubricating oil, heat-conducting oil or liquid metal containing component of gallium, indium, tin, zinc and silver. A packaging film body comprises a first packaging film part and a second packaging film part. The heat conducting paste and/or heat conducting liquid is coated between the first packaging film part and the second packaging film part. USE - Heat conducting film for an electronic component of a circuit board assembly of an electronic device (All claimed) e.g. mobile phone and tablet computer. ADVANTAGE - The heat conducting efficiency of the high integration chip is improved. The processing difficulty of the vertical graphene film body is reduced so as to effectively control the micro-direction of the graphene. The film has simple process, low cost, and can be scaled and standardized, and can be utilized for commercial production. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing a heat-conducting film. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat conducting film. 46Heat conducting film 461Vertical graphene film 463Heat conducting liquid