• 专利标题:   Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.
  • 专利号:   WO2021255580-A1, CN115702196-A, EP4165119-A1, JP2023529501-W
  • 发明人:   PEREZ M A, MARTINEZ J A
  • 专利权人:   3M INNOVATIVE PROPERTIES CO, 3M INNOVATIVE PROPERTIES CO
  • 国际专利分类:   C08K003/04, C08K003/22, C08K003/28, C09K005/14, C08L101/00
  • 专利详细信息:   WO2021255580-A1 23 Dec 2021 202210 Pages: 18 English
  • 申请详细信息:   WO2021255580-A1 WOIB055049 08 Jun 2021
  • 优先权号:   US039235P, CN80042503

▎ 摘  要

NOVELTY - Flowable hardenable composition (C1) comprises 10-95 vol.% shaped composite particles (100) dispersed in a hardenable binder precursor, where the shaped composite particles comprise thermal filler particles (110) having an aspect ratio of at least 1.5 retained in a binder matrix (120). USE - The composition is useful in thermally conductive composition which is used in electronic heat sink assembly (all claimed), electronic devices, electric batteries for autos, electronics (e.g. including electronics used in Fifth Generation (5G) telecommunications), electrical insulation for motors and transformers, and as dielectric thermal transfer media (gap fillers) in automotive lithium battery assemblies. ADVANTAGE - The composition: has a thermal conductivity of at least 1 W/m.K, preferably at least 2.5 W/m.K; and provides thermal cooling at lower levels of thermal filler particles than compositions. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) a thermally conductive composition (C2) comprising the composition (C1); and (2) an electronic heat sink assembly comprising an electronic component, a heat sink and the thermally conductive composition (C2) sandwiched between the electronic component and the heat sink. DESCRIPTION OF DRAWING(S) - The figure illustrates schematic perspective view of shaped composite particle. Shaped composite particles (100) Thermal filler particles (110) Binder matrix (120) Top (130) Bottom (140)