▎ 摘　　要

NOVELTY - Composite heat-conducting shielding material (10) comprises a flexible heat conductivity film (101) and a first metal layer (102). The flexible heatconductivity film includes a first surface and a second surface. The first metal sheet is arranged on the first surface to form a first composite structure (103), and the second metal sheet forms a second composite structure (105). The second metal layer is provided with a third metal sheet and a fourth metal sheet. USE - Composite heat-conducting shielding material used in an electronic device i.e. integrated circuit (IC) chip, of an electronic industry. ADVANTAGE - The material adopts heat-conducting shielding integrated solution combining pleated forming process, so that the prepared composite material has high heat conducting-high shielding-high compression performance. The pleated structure can be deformed so as to connect the material with the structure such as integrated circuit (IC) chip, radiator and so contact, thus providing excellent tolerance capability. The material can be used as heat interface material between the IC chip and the radiator, and can reduce the gap and thermal resistance between the chip-heat sink, which is good for electronic device, such as mobile phone, computer and so on thinning and production, and low installation cost. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: 1. A method for preparing composite heat-conducting shielding material, which involves providing a flexible heat conducting film, the flexible heat conducting film has a first surface, setting a metal layer on the first surface, forming a first composite structure; stretching an elastic structure to form pre-stretched elastic structure, setting the first composite structure to a surface of the pre-stretched elastic structure, retracting the pre-stretched elastic structure, the first composite structure forms a second composite structure having a multiple of pleated structures. 2. An electronic device, which comprises a composite heat-conducting shielding material, a chip, a printed circuit board, a shielding frame and a radiating structure; the chip is set on the surface of the printed circuit board, where the composite heat-conducting shielding material is set on the surface of the chip far away from the printed circuit board, the shielding frame is set around the chip, the radiating structure is set on the surface of the composite heat-conducting shielding material far away from the chip. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic flow chart of a method for preparing a composite heat-conducting shielding material. Prepared composite heat-conducting shielding material (10) Flexible heat conducting film (101) First metal layer (102) First composite structure (103) Pre-stretched elastic structure (104) Second composite structure (105) Material layer (107) Third composite structure (108) First surface (1010) Second surface (1012) First surface (1040) Obtained wrinkle structure (1052)