▎ 摘 要
NOVELTY - The method (300) involves arranging (302) a stamp coating on a stamp, where the stamp has an inverse optical device pattern of inverse structures. The inverse structure bottom and the inverse structure top are etched (303) with an etch process having an etch direction parallel to the sidewalls such that the stamp coating remains on the sidewall and the stamp coating is removed from the inverse structure top and the inverse structure bottom. The stamp is imprinted (304) into an imprintable optical device material arranged on the optical device substrate. The imprintable optical device material is subjected (305) to a cure process, where the cure process transfers the optical device critical dimension to the optical device structure of the optical device pattern formed by the cure process. USE - Method for forming optical device such as augmented reality waveguide combiner and flat optical device, using nanoimprint lithography, used in display device e.g. augmented reality, virtual reality, and mixed reality. ADVANTAGE - The optical device substrate adequately transmits the light in a desired wavelength or wavelength range and serves as an adequate support for the optical devices. The inverse structures are angled, where the etch process is an angled etch process. If vertical shrinkage occurs, the critical dimension is maintained to ensure the pattern fidelity of the optical device. The quality of the optical device is improved due to the control of the critical dimension. The sidewalls of the stamp are coated to prevent lateral solvent flow maintains the critical dimension of the optical device structures. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram of a method for forming an optical device. 300Method for forming an optical device 302Step for arranging a stamp coating on a stamp 303Step for etching an inverse structure bottom and an inverse structure top with an etch process having an etch direction parallel to the sidewalls 304Step for imprinting the stamp into an imprintable optical device material arranged on the device substrate 305Step for subjecting the imprintable optical device material to a cure process