• 专利标题:   Silicon carbide-containing epoxy resin composite material for copper clad laminate, comprises bisphenol A type phenolic epoxy resin, methylimidazole, aluminum nitride, graphene, ethylenediamine, polythiophenes, and dibutyltin dilaurate.
  • 专利号:   CN106832792-A
  • 发明人:   SUN M, WANG Y, ZHANG J
  • 专利权人:   TONGLING HUAKE ELECTRONIC MATERIAL CO
  • 国际专利分类:   C08K013/06, C08K003/04, C08K003/28, C08K003/36, C08K007/08, C08K009/02, C08K009/04, C08K009/06, C08L015/00, C08L063/04, C08L083/04
  • 专利详细信息:   CN106832792-A 13 Jun 2017 C08L-063/04 201752 Pages: 5 Chinese
  • 申请详细信息:   CN106832792-A CN11255971 30 Dec 2016
  • 优先权号:   CN11255971

▎ 摘  要

NOVELTY - Silicon carbide-containing epoxy resin composite material comprises 35-53 bisphenol A type phenolic epoxy resin, 8-13 2-methylimidazole, 9-16 silica, 5-12 aluminum nitride, 6-10 graphene, 7-10 ethylenediamine, 3-6 polythiophenes, 2-4 dibutyltin dilaurate, 5-9 multi-walled carbon nanotubes, 5-8 calcium carbonate whiskers, 3-5 terminal carboxyl liquid polybutadiene rubber, 2-4 benzyl dimethylamine, 3-6 alumina, 4-7 silicon nitride, 5-8 antimony oxide, butanone, KH550, ethanol, dimethylformamide, distilled water, and sodium hydroxide solution. USE - Silicon carbide-containing epoxy resin composite material for a copper clad laminate. ADVANTAGE - The silicon carbide-containing epoxy resin composite material has a large thickness ratio, excellent tensile strength and thermal stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing silicon carbide-containing epoxy resin composite material, which involves: (A) adding sedum hydroxide solution to aluminum nitride with stirring at 80-90 degrees C for 1-2 hours to prepare a mixture; (B) centrifuging and washing the prepared mixture with alcohol; (C) drying at 60-70 degrees C for 2-4 hours to get hydroxylated aluminum nitride; (D) adding silica and KH550 at 50-60 degrees C in ultrasonic dispersion for 3-4 hours; (E) placing the formed mixture in a muffle furnace at 450-550 degrees C for 1-2 hours; (F) adding oxidized graphene in dimethylformamide and ethylenediamine at 110-130 degrees C for 3-6 hours; (G) adding polythiophenes, dibutyl tin dilaurate, distilled water and multi-walled carbon nanotubes under thermostatic reaction for 3-5 hours for 1-2 hours; (H) drying the calcium carbonate whiskers at 110-130 degrees C for 2-3 hours; (I) mixing with KH550 with stirring at room temperature for 5-10 hours to obtain surface modified calcium carbonate whisker; (J) placing bisphenol A type phenolic epoxy resin, terminal carboxyl liquid polybutadiene rubber, and benzyl dimethylamine in an oil bath with stirring under heating at 130-140 degrees C for 3-4 hours at room temperature; (K) adding acetone, alumina, silicon nitride and antimony oxide with stirring for 3-5 ; (L) dissolving 2-methylimidazole in methyl ethyl ketone; and (M) adding in the obtained material with stirring at 85-95 degrees C for 4-8 hours to get the composite material.