▎ 摘　　要

NOVELTY - High thermal conductivity graphene heat dissipation material includes a metal foil substrate, the upper surface of the metal foil substrate is uniformly coated with a layer of graphene heat dissipation coating, and the lower surface of the metal foil substrate is uniformly coated with a thermally conductive adhesive layer. A release film is adhered to the outer layer of the thermally conductive adhesive layer. The graphene powder is ultrasonically dispersed in a solvent to form a graphene dispersion, and then the graphene dispersion is uniformly coated on the upper surface of the metal foil substrate. The graphene heat dissipation coating is obtained, and the thermal conductivity of the graphene heat dissipation coating is 2000-2300 watt/meter kelvin. USE - High thermal conductivity graphene heat dissipation material. ADVANTAGE - The medium-high thermal conductivity graphene heat-dissipating material can be automatically and continuously produced, is rolled and stored, is convenient to use, and has good thermal conductivity and heat dissipation performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a process for preparing high thermal conductivity graphene heat dissipation material, whic involves: (A) weighing graphene and solvent according to the corresponding ratio, and ultrasonically dispersing for 20-30 minutes to obtain a graphene dispersion; (B) configuring the corresponding adhesive according to the product requirements, and then adding a quantitative amount of thermally conductive powder to the adhesive, stirring and mixing uniformly to obtain a thermally conductive adhesive; (C) coating the graphene dispersion on the upper surface of the metal foil substrate, and drying and curingby ultraviolet light or hot air to form a graphene heat dissipation coating; and (D) coating the thermally conductive adhesive on the lower surface of the metal foil substrate, and forming a thermally conductive adhesive layer after curing treatment, and attaching a release film to the thermally conductive adhesive layer to be wound to obtain a high thermal conductivity graphene heat dissipation material.