▎ 摘　　要

NOVELTY - The semiconductor chip has graphene film (124) that is formed at the boundary of coaxial penetration silicone via (120). The secondary via (122) transfers ground voltage to passive device and primary via (121) delivers signal or power supply voltage. The primary via is surrounded around the coaxial penetration silicone via. An active layer (130) is formed in one side of the substrate (110). USE - Semiconductor chip of three-dimensional stacked chip package (claimed) used in notebook computer, personal digital assistant, and mobile telephone. ADVANTAGE - Since the graphene film is formed between the secondary via delivering the insulation portion and ground voltage, the structural stability and electrical performance of the coaxial penetration silicone via can be enhanced. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the semiconductor chip. Substrate (110) Coaxial penetration silicone via (120) Primary via (121) Secondary via (122) Graphene film (124) Active layer (130)