▎ 摘　　要

NOVELTY - The high heat-conducting soft cushion has multiple groups of graphite film layer, a first silicone resin layer, a carbon fiber film layer, a graphene layer, and a second silicone resin layer, arranged in turn, Each layer surface of each group is set with heat source. The graphite film layer of the outer layer and the second silicone resin layer of the outer layer are provided with a layer of pressure-sensitive adhesive film. The surface of the carbon fiber film layer is bonded with heat conducting particles. The first silicone resin layer and the second silicone resin layer are supported by glass fiber or ceramic particle mesh. USE - The high heat-conducting soft cushion is useful in microelectronic integrated technology and high density printed board assembly technology. ADVANTAGE - The prepared high heat-conducting soft pad has excellent heat dissipation performance, has a certain wear-resistant corrosion resistance to obtain the structure of the graphite film layer and the graphene layer overlapped, strengthening and improving the radiating effect, has light weight, and has good heat transfer performance in horizontal direction and vertical direction, the heat transfer is more uniform. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation method of high heat-conducting soft pad. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of a high heat-conducting soft cushion. Graphite film layer (1) First silicone resin layer (2) Carbon fiber film layer (3) Graphene layer (4) Second silicone resin layer (5) Pressure-sensitive adhesive film (6)