• 专利标题:   Conductive composite material with an isolation structure comprises polymer substrate, and conductive filler.
  • 专利号:   CN113278218-A, CN113278218-B
  • 发明人:   MA Y, MAO Y, ZHANG J, CAO X, ZHENG K, YE G, XUE C
  • 专利权人:   CHINESE ACAD SCI CHEM INST
  • 国际专利分类:   C08K003/04, C08K003/08, C08K007/06, C08L023/06, C08L023/08, C08L023/12, C08L067/04, C08L069/00
  • 专利详细信息:   CN113278218-A 20 Aug 2021 C08L-023/12 202175 Pages: 13 Chinese
  • 申请详细信息:   CN113278218-A CN10104188 20 Feb 2020
  • 优先权号:   CN10104188

▎ 摘  要

NOVELTY - Conductive composite material with an isolation structure comprises 95-99.99 pts. wt. polymer substrate, and 0.01-5 pts. wt. conductive filler, where the polymer substrate is a powder with a particle size not greater than 1000 mu m. The melt index of the polymer substrate is 1-10 g/10 minute. USE - Used as conductive composite material with an isolation structure. ADVANTAGE - The conductive composite powder can be formed by a self-leveling process without applying external force, which maintains the integrity of the conductive network of the isolation structure to the greatest extent. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing a conductive composite material with an isolation structure comprising adding conductive filler into water and dispersing to obtain a conductive slurry with a solid content of 1-4 wt.%, mixing the conductive paste with the polymer substrate, drying to obtain conductive composite powder, spreading the conductive composite powder flat in the mold, tapping, adding into an oven, heating to 180-280 degrees C, maintaining the temperature for 10-60 minutes, and then reducing the temperature to obtain the product.