• 专利标题:   Method for forming graphene film used for e.g. flexible electronics application, involves heating copper-containing substrate, exposing substrate to carbon-containing precursor gas to dissolve carbon atoms into substrate, and cooling.
  • 专利号:   WO2013113706-A1, EP2809614-A1, US2015017344-A1
  • 发明人:   DONG G, VAN RIJN R
  • 专利权人:   RIJKSUNIV LEIDEN, RIJKSUNIV LEIDEN, DONG G, VAN RIJN R
  • 国际专利分类:   C01B031/04, C23C016/02, C23C016/26, C23C016/455, C23C016/46, C23C016/56
  • 专利详细信息:   WO2013113706-A1 08 Aug 2013 C01B-031/04 201355 Pages: 25 English
  • 申请详细信息:   WO2013113706-A1 WOEP051701 29 Jan 2013
  • 优先权号:   GB001600, US592620P

▎ 摘  要

NOVELTY - A copper-containing substrate (12a) is heated to an exposure temperature and exposed to a carbon-containing precursor gas at the exposure temperature for a predetermined period of time to dissolve carbon atoms into the substrate and saturate the substrate with carbon atoms. The obtained substrate is cooled such that the dissolved carbon atoms (16) are segregated from the substrate, to form a graphene film (20) on the surface(s) (10) of the substrate. The copper-containing substrate is selected based on its thickness to control the depth of the graphene film. USE - Method for forming graphene film. Uses include but are not limited to flexible electronics, laser, biosensor, atomically thin protective coating, hydrogen storage and energy storage applications. ADVANTAGE - The method enables formation of thin graphene film with high carrier mobility and quality, by simple process. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view illustrating segregation of dissolved carbon atoms to form graphene film on the planar surface of the copper-containing substrate. Surface (10) Copper-containing substrate (12a) Dissolved carbon atoms (16) Graphene film (20)