▎ 摘　　要

NOVELTY - Microelectronic assembly (100) comprises an interposer having a first surface and an opposing second surface, a first microelectronic component coupled to the second surface of the interposer by a first direct bonding region, a second microelectronic component coupled to the second surface of the interposer by a second direct bonding region, a liner material on the second surface of the interposer and around the first and second microelectronic components, and a thermally conductive fill material on the liner material and between the first and second microelectronic components. USE - Microelectronic assembly. ADVANTAGE - The assembly has improved materials and structures that enable the composite die to be made with inorganic materials that can be exposed to high temperatures and allow better heat dissipation, and that can be handled more easily during processing to allow for more streamlined manufacturing relative to conventional approaches, has avoided outgassing, over-softening, or degradation of the dielectrics, which can cause damage to the individual dies and/or to the interconnects between the dies and the wafer, has reduced performance by preventing heat transfer away from a heat source and has improved power delivery, signaling, and potential thermal benefits. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the microelectronic assembly. Microelectronic assembly (100) Insulating material (106) Contacting db dielectrics (108) Complementary db contact (110) Intervening solder (120)