• 专利标题:   Chip-level packaging LED, has LED epitaxial wafer sheet provided with positive electrode, negative electrode, graphene layer and fluorescent powder thin layer, where graphene layer arranged on fluorescent powder thin layer.
  • 专利号:   CN106653975-A
  • 发明人:   GUO Z, YI X, SUN H, SUN J, HUANG J, GUO M, YANG X
  • 专利权人:   UNIV SOUTH CHINA NORMAL
  • 国际专利分类:   H01L033/00, H01L033/48, H01L033/50, H01L033/64
  • 专利详细信息:   CN106653975-A 10 May 2017 H01L-033/48 201740 Pages: 7 Chinese
  • 申请详细信息:   CN106653975-A CN11169366 16 Dec 2016
  • 优先权号:   CN11169366

▎ 摘  要

NOVELTY - The LED has an LED epitaxial wafer sheet provided with a positive electrode, a negative electrode and an electrode channel. The positive electrode and the negative electrode are located on plane. The electrode channel is formed between the positive electrode and the negative electrode. The LED epitaxial wafer sheet is provided with a graphene layer and a fluorescent powder thin layer. The graphene layer is arranged on the fluorescent powder thin layer. The LED epitaxial wafer sheet is provided with an n-type layer and a p-type layer. USE - Chip-level packaging LED. ADVANTAGE - The LED is convenient to maintain, and has better heat conducting effect, and reduces color temperature rate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a chip-level packaging LED manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a chip-level packaging LED.