▎ 摘　　要

NOVELTY - The method involves coating the silicon substrate with a layer of Hexamethyldisilazane and with a photoresist layer. A seed nickel layer is deposited onto the silicon dioxide layer. A layer of electroplated nickel is grown, where the electroplated nickel layer is provided with a thickness between 1 pm to 5 pm. A graphene layer is grown on the nickel electrodes by plasma enhanced chemical vapor deposition. The polypyrrole layer is spin-coated and patterned, where the polypyrrole layer is comprised of a thickness between 5 pm and 20 pm. A polyvinyl alcohol layer is deposited onto the nickel electrodes. The two supercapacitor cells are stacked together by a flip-chip method. The second supercapacitor cell upside-down is flipped. The two supercapacitor cells are aligned with matching pads provided on the two supercapacitor cells. A solder is provided between the matching pads. The two supercapacitor cells are interconnected with the polyvinyl alcohol gel curing. USE - Method for manufacturing supercapacitor such as high capacitance vertical graphene interdigital supercapacitor with two supercapacitor cells for powering biomedical devices. ADVANTAGE - The double stacked supercapacitor is provided with significantly increased charging capacity while maintaining the area of the planar design, which lasts longer and there is no need for replacement of the supercapacitor, or the need for replacement of the supercapacitor is strongly reduced. The double stacked supercapacitor with interdigital electrode with vertical aligned graphene has several advantages, such as size reduction in single chip, diffusion controllable current, low charging current, reduced solution resistance effects. The instance lightweight dimensions and minimal production costs are achieved. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic flow diagram illustrating the process of fabrication of double stacked supercapacitor with interdigital structure of electrodes.