▎ 摘　　要

NOVELTY - A modified urea-formaldehyde resin adhesive, comprises 2-5 wt.% graphene, 200-260 wt.% urea, 8-12 wt.% diatom mud, 320-450 wt.% aqueous formaldehyde solution, 2-6 wt.% melamine, 8-12 wt.% sticky rice flour, 20-35 wt.% crosslinked starch, 2-3 wt.% sodium silicate, 1-4 wt.% nanoceramic powder, 6-9 wt.% polyurethane, 23-35 wt.% flame retardant, 3-8 wt.% polyvinyl alcohol, 3-5 wt.% terephthalaldehyde, and 10-30 wt.% methanol. USE - Modified urea-formaldehyde resin adhesive used for manufacturing artificial board. ADVANTAGE - The adhesive has improved adhesive property by adjusting the solution and comprehensive performance, and reduced free formaldehyde. The product prepared is strong, has excellent flame retardance, is environmentally-friendly, and has high transparency, no mixed color, and strong weather resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of modified urea-formaldehyde resin adhesive, which involves (1) placing 320-450 wt.% aqueous formaldehyde resin in enamel reaction vessel, adjusting pH to be alkaline with conditioning solution, and adding 3-8 wt.% polyvinyl alcohol and 100-140 wt.% urea to reactor, heating to 90-95 degrees C for 40-50 minutes, (2) cooling the enamel reactor, adding 10-30 wt.% methanol and 1-2 wt.% melamine, polycondensing, adjusting pH of solution to 7.5-8.8, and raising temperature to 75-80 degrees C, and then adding 100-120 wt.% urea for carrying out reaction, (3) and reversing (2) by adding 1-4 wt.% melamine and 3-5 wt.% terephthalaldehyde, stirring for 15-30 minutes, and distilling under reduced pressure, recycling obtained formaldehyde, (4) heating to 85-90 degrees C for 12 minutes, adding 23-45 wt.% flame retardant, 8-12 wt.% diatom mud, 2-5 wt.% graphene, 1-4 wt.% nanoceramic powder, stirring evenly, and reacting for 30-35 minutes, (5) cooling to 50 degrees C, adding 8-12 wt.% sticky rice flour, 20-35 wt.% crosslinked starch, 2-3 wt.% sodium silicate, 6-9 wt.% polyurethane, stirring for ten minutes, cooling uniformly below 40 degrees C, adjusting pH between 7.5-8.0 with conditioning solution, and discharging at room temperature.