• 专利标题:   Graphene indoor rapid-heating wallboard, has graphene heating wall provided with heat insulation layer, alloy honeycomb core board fixed between heating chip and graphene coating heat-conducting film by high heat-conducting filling agent.
  • 专利号:   CN110332589-A, CN210740519-U
  • 发明人:   CHEN X
  • 专利权人:   BEIJING YOUYISHI TECHNOLOGY CO LTD
  • 国际专利分类:   E04F013/075, F24D013/02
  • 专利详细信息:   CN110332589-A 15 Oct 2019 F24D-013/02 201983 Pages: 7 Chinese
  • 申请详细信息:   CN110332589-A CN10650473 18 Jul 2019
  • 优先权号:   CN10650473, CN21131331

▎ 摘  要

NOVELTY - The wallboard has a graphene heating wall provided with a heat insulation layer i.e. polyurethane heat insulating plate, a graphene heating layer, a graphite heat transfer layer i.e. alloy honeycomb core board and a surface layer i.e. nickel or nickel alloy decorative layer. A honeycomb cavity of the alloy honeycomb core board is filled with high heat-conducting filling agent. The alloy honeycomb core board is fixed between a heating chip and a graphene coating heat-conducting film by the high heat-conducting filling agent. The alloy honeycomb core board comprises an upper high-thermal-conductive Carbon fiber panel, an alloy honeycomb core and a lower layer high-thermal-conductive Carbon fiber panel. USE - Graphene indoor rapid-heating wallboard. ADVANTAGE - The wallboard has high heat conduction efficiency and high heating speed. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a graphene indoor rapid-heating wallboard realizing method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a graphene indoor rapid-heating wallboard.