• 专利标题:   Heat-conducting wave-absorbing composite film for use in electronic chip, has reducing graphene layer connected with MXene nano sheet layer through carbon particle layer.
  • 专利号:   CN216930697-U
  • 发明人:   FANG X, HE X, ZHOU X, DOU L, YANG S, SUN A, CAO Y
  • 专利权人:   SHENZHEN HFC CO LTD
  • 国际专利分类:   H01Q017/00, H05K007/20, H05K009/00
  • 专利详细信息:   CN216930697-U 08 Jul 2022 H05K-009/00 202259 Chinese
  • 申请详细信息:   CN216930697-U CN22827862 17 Nov 2021
  • 优先权号:   CN22827862

▎ 摘  要

NOVELTY - The application relates to a heat-conducting wave-absorbing composite film, comprising a reducing graphene layer and MXene nano-sheet layer connected with the reducing graphene layer. The MXene application-sheet layer and the reducing graphene layer form a layered structure of the composite film, the composite film of the layered structure and each layer generated by the micro-pore can make the electromagnetic wave for multiple times of reflection/scattering, achieving good wave absorbing effect, the maximum electromagnetic shielding efficiency of the composite film reaches 105dB; At the same time, each layer of the composite film has excellent heat-conducting performance, so that the heat-conducting coefficient of the whole composite film can reach to 2200W/ (m k)).