▎ 摘　　要

NOVELTY - The pad (140) has a base portion mounted on an upper surface of a blade (130). A pattern portion is formed on the upper surface of the base portion and provided with fine patterns. The base portion and the pattern portion are provided with a stretchable base material and a heat-resistant material. The base material is a flexible elastomer, silicone-based elastomer, fluoroelastomer, perfluoroelastomer and PTFE. The heat-resistant material is a carbon nano tube, graphene, C60, C540, C70, amorphous carbon, graphite, polyimide, polyacetylene, polyt Offene, polyaniline, polypyrrole, polyparaphenylene, polyphenylene vinylene, polyparaphenylene sulfide, poly p phenylene vinylene, poly iso thianaphthene, polyhedral oligomeric silsesquioxanes, dimethylsiloxane-diphenylsiloxane copolymer, fumed silica and poly thienylene vinylene. USE - Non-slip pad for loading and unloading semiconductor wafers provided on wafer transfer robot and mounted on blade. ADVANTAGE - The heat-resistant material stably mounts a high-temperature semiconductor wafer during a semiconductor manufacturing process on the robot arm, thus improving process stability. The heat-resistant and conductive materials prevent the wafer from slipping by the surface charge by grounding the surface charge aggregated on the surface of the anti-slip pad with a blade. The wafers are prevented from being damaged by preventing them from being mounted with excessive mounting force on the pads. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the non-slip pad. Blade (130) Blade housing (131) Screw hole (133) Blade tip (135) Non-slip pad (140)