• 专利标题:   Peeling and disassembling adhesive on-demand, comprises e.g. simultaneously adding ion conductive fillers and electronic conductive fillers to bonding precursor, and uniformly mixing.
  • 专利号:   CN112521886-A
  • 发明人:   WEI Y
  • 专利权人:   UNIV SOUTHWEST SCI TECHNOLOGY
  • 国际专利分类:   C09J109/02, C09J011/04, C09J011/06, C09J133/26, C09J151/08, C09J163/02, C09J175/04, C09J183/07, C09J005/00
  • 专利详细信息:   CN112521886-A 19 Mar 2021 C09J-011/06 202134 Pages: 7 Chinese
  • 申请详细信息:   CN112521886-A CN11467026 14 Dec 2020
  • 优先权号:   CN11467026

▎ 摘  要

NOVELTY - Peeling and disassembling adhesive on-demand, comprises simultaneously adding ion conductive fillers and electronic conductive fillers to the bonding precursor, and uniformly mixing by using a certain process to obtain adhesive with ionic conductivity and electronic conductivity on-demand peeling and disassembly. USE - The method is useful for peeling and disassembling adhesive on-demand. ADVANTAGE - The method: is simple and efficient; solves the current problem that the substrate to be bonded is not easily disassembled and peeled after being bonded with an adhesive; and has broad application prospects. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for use method of the adhesive, comprising applying the adhesive to the substrate to be bonded through a sizing process, curing, bonding and fixing, and applying voltage on both sides of the bonded object to achieve peeling and disassembly on demand, where the bonding substrate to be bonded is a metal interface or a conductive surface.