▎ 摘　　要

NOVELTY - A heat-radiating interface material (4) comprises (pts.wt.) silicone resin component A (100) and silicone resin component B (2) as substrate, dimethyl silicone oil (20-30), and functional graphene micro sheet (0.5-2) as a heat-conducting filler. USE - A heat-radiating interface material used for a large-power LED lamp package (claimed). ADVANTAGE - The heat-radiating interface material avoids the LED chip metal frame of a liquid crystal display module heat dissipation seat and a contact gap between a lamp shell radiating structure, reduces interfacial contact thermal resistance, and improves size, reliability, and service life of the package. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) preparing functional graphene micro sheet by adding 4 g natural crystalline flake graphite into 92 mL concentrated sulfuric acid, uniformly stirring , adding 2 g sodium nitrate and 12 g potassium permanganate, at 0-5 degrees C in constant temperature water bath, stirring for 2 hours, increasing the temperature of a constant temperature water bath temperature to 35 degrees C, continuously stirring for 2 hours, increasing temperature of the constant temperature water bath to 99 degrees C, continuously stirring to obtain a bright yellow color sample, adding 120 mL of 5 wt.% hydrogen peroxide, filtering, washing with deionized water until neutral, drying at 60 degrees C for 48 hours, obtaining graphite oxide, placing in a microwave oven in nitrogen gas atmosphere at 1600 W, heating for 15 seconds, heating for 30 minutes, microwave oven working temperature reaches 600 plus minus 50 degrees C, heating and insulating temperature at 2 minutes, cooling along with the furnace, and carrying out surface modification using silane coupling agent KH-550; and (2) preparing the heat-radiating interface material, comprising adding silicone resin component A, dimethyl silicone oil, and functional graphene micro sheet on a double-roller mixer at room temperature; repeatedly mixing for 30 minutes; adding silicone resin component B; uniformly mixing in the mixer to obtain a primary heat-radiating interface material; placing the primary heat radiating interface material in a mold cavity having a polyester film substrate; pressing on a flat vulcanizing machine to obtain a flexible patch-shaped heat radiating interface material having a thickness of 0.3-0.5 mm; to avoid double-component silicone to generate the final gas generated on the interface material in the cavity, where the pressing process is carried out, conditions include temperature of the mold is 120 degrees C, pressure is 14 MPa, and the pressure maintaining time is 30 minutes; and cutting, and removing lower surface of the polyester film. DESCRIPTION OF DRAWING(S) - The drawing is a sectional view of the LED lamp package. Led lamp lens (1) LED chip module (2) LED chip module radiating base (3) Heat-radiating interface material (4) LED lamp shell radiating structure (5)