• 专利标题:   Heating system of thermally resilient molding for heating of aggregates and materials, has electrically conductive structure layer that is provided with defined network of aluminum, graphene nano-platelets, molybdenum or tungsten.
  • 专利号:   DE102016009226-A1
  • 发明人:   BEIER G
  • 专利权人:   BEIER G
  • 国际专利分类:   F24H001/00, H05B003/12
  • 专利详细信息:   DE102016009226-A1 01 Feb 2018 H05B-003/12 201811 Pages: 4 German
  • 申请详细信息:   DE102016009226-A1 DE10009226 28 Jul 2016
  • 优先权号:   DE10009226

▎ 摘  要

NOVELTY - The system has a main portion that is geometrically constructed by combination of electrically and thermally specified materials in electrical contacting for generating the infrared thermal radiation at current flow. The electrically conductive structure layer is provided with a defined network of aluminum, graphene nano-platelets, molybdenum or tungsten. The structural characteristic of conductive structure layer is utilized in an application-defined manner. USE - Heating system of thermally resilient molding for heating of aggregates and materials in defined and combined form of metal hollow chamber web plates or water-bearing systems. ADVANTAGE - The performance of the heating system is improved. The individual devices are assembled into cascades depending on requirements. The unwanted heat dissipation into the room is prevented. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the heating system. (Drawing includes non-English language text)