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  • 专利标题:   Insulated thermal interface material for applying between electronic element e.g. central processing unit, and thermal dissipating element, comprises base including polymer, and filler including graphene dispersed in base.
  • 专利号:   US2013299140-A1, TW201345963-A, TW598385-B1
  • 发明人:   LING Y, WANG C, LIU J, LING Y C, WANG C P, LIU J Y
  • 专利权人:   UNIV NAT TSINGHUA
  • 国际专利分类:   F28F003/00, C08G059/40, C08K003/04, C08K003/22, C08L063/00, C08L083/04, H05K007/20
  • 专利详细信息:   US2013299140-A1 14 Nov 2013 F28F-003/00 201377 Pages: 15 English
  • 申请详细信息:   US2013299140-A1 US886477 03 May 2013
  • 优先权号:   TW116708

▎ 摘　　要

NOVELTY - An insulated thermal interface material (10) comprises a base comprising polymer, and filler (11) and filler (12) dispersed in the base. The filler (11) includes graphene. USE - Insulated thermal interface material is used for applying between electronic element e.g. central processing unit, and thermal dissipating element of high-power transistor chip. Uses include but are not limited to power transistor, metal oxide semiconductor transistor, field-effect transistor, thyristor, rectifier and transformer. ADVANTAGE - The insulated thermal interface material has excellent conductivity and thermal insulation characteristics. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of structure of insulated thermal interface material. Insulated thermal interface material (10) Fillers (11,12) Silicone rubber (13) Thermal energy (T)