▎ 摘　　要

NOVELTY - Thermally conductive gasket comprises a thermally conductive filler layer. The thermally conductive filler layer includes granular thermally conductive fillers. The adjacent thermally conductive fillers are in direct contact to form a continuous three-dimensional thermally conductive network containing internal voids. The inner voids of the three-dimensional thermally conductive network are filled with high molecular polymers. USE - The thermally conductive gasket and mold is useful in electronic device heat conducting material field. Can also be used in electronic electrician field. ADVANTAGE - The thermally conductive gasket has excellent heat conducting performance; ensures the direct contact between the fillers and ensures the formation of a three-dimensional thermal conduction path; and improves the thermal conductivity of the thermal pad. The application method is simple and economical, and good universality. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) a preparation method of thermally conductive gasket; and (2) a mold for preparing thermally conductive gasket. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic structural diagram of the disassembly of a mold used for preparing a thermally conductive gasket. Clapboard (3) Net sheet (4) Fastening screw (5) Heat-conducting filler layer forming chamber (6) High-molecular polymer storage chamber (7)