▎ 摘　　要

NOVELTY - The utility model claims a new cooling technique area, especially relates to a kind of one cooling device. Can comprise a sealed cooling space, semiconductor refrigerating sheet, electric connected with said semiconductor refrigerating sheet and is the direct current power supply and power supply. The semiconductor cooling chip comprising for cold side of heat, for heat end of heat abstractor, equipped with the N type semiconductor at the cold end and hot end between, is set with the P type semiconductor at the cold end and the hot end between, and connected with the N type semiconductor and metal conductor and the P type semiconductor, the metal conductor is set with used for connected with positive negative electrode of the electric source, the cold end and the cooling space guide heat connection. Wherein the wherein: the N type semi-conductor formed graphene layer or the P type semiconductor is set with graphene layer or said N type semiconductor and said P type semiconductor are provided with graphene. The graphene layer can increase the temperature between cold end and hot end of the semiconductor cooling piece, mounting the semiconductor refrigerating sheet lower end radiating heat device and information on hot end would not be.