▎ 摘　　要

NOVELTY - The device has a cold-conducting bonding layer (5) tightly adhered on a cold effect surface of a semiconductor refrigerating sheet (1). A radiating metal structure (4) is made of aluminum and/or copper and/or superconducting material. A heat-conducting bonding layer (6) is tightly adhered on a heat effect surface of the semiconductor refrigerating sheet. A material of the cold-conducting bonding layer and the heat-conducting bonding layer is made of graphene and/or silver and/or nano-copper powder, silicone grease and/or liquid metal. USE - Used as temperature adjustable refrigerating device. ADVANTAGE - The heat of the heat effect surface of the semiconductor refrigerating sheet is quickly taken away by the radiating metal structure to output the maximum refrigerating amount. The temperature control circuit board can adjust the output power and the temperature of the cold conducting surface can be adjusted. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for radiating support of a metal machine body of a notebook computer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the temperature adjustable refrigerating device. Semiconductor refrigerating sheet (1) Radiating metal structure (4) Cold-conducting bonding layer (5) Heat-conducting bonding layer (6)