• 专利标题:   Graphene modified low temperature solder comprises graphene, and solder alloy.
  • 专利号:   CN111112881-A
  • 发明人:   CHEN Q, XU H, ZHANG Y, LIANG S, WENG R, GONG M, CHEN X
  • 专利权人:   SUZHOU EUNOW ELECTRONIC MATERIAL TECHNOL
  • 国际专利分类:   B23K035/362
  • 专利详细信息:   CN111112881-A 08 May 2020 B23K-035/362 202041 Pages: 12 Chinese
  • 申请详细信息:   CN111112881-A CN10003929 03 Jan 2020
  • 优先权号:   CN10003929

▎ 摘  要

NOVELTY - Graphene modified low temperature solder composition comprises 0.1-0.5 wt.% graphene, and solder alloy (balance). USE - Used as a graphene modified low temperature solder. ADVANTAGE - The solder has good toughness and strength, improved tensile strength, ductility and welding point toughness properties. The method improves dispersibility of solder material, and solves the problem of graphene floating. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparation of the graphene modified low temperature solder comprising (1) placing graphene in absolute ethanol, ultrasonically treating for 1-2 hours, ball milling for 10-50 minutes, taking out, drying and grinding graphene, and (2) finishing grinding, adding to molten solder alloy, stirring under protection of nitrogen for 10-30 minutes, cooling, and shaping to obtain product.