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  • 专利标题:   Electrolytic copper foil used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display, has preset tensile strength before and after subjecting to heat-treatment.
  • 专利号:   WO2017188601-A1, KR2017123181-A, KR1802949-B1, CN109072466-A, US2019071790-A1
  • 发明人:   JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K
  • 专利权人:   ILJIN MATERIALS CO LTD, ILJIN MATERIALS CO LTD
  • 国际专利分类:   B82Y030/00, C01B032/182, C25D003/38, C25D005/50, C25D007/06, C01B031/04
  • 专利详细信息:   WO2017188601-A1 02 Nov 2017 C25D-003/38 201777 Pages: 12
  • 申请详细信息:   WO2017188601-A1 WOKR003007 21 Mar 2017
  • 优先权号:   KR052528, CN80026112

▎ 摘　　要

NOVELTY - An electrolytic copper foil has tensile strength at room temperature of 45-70 kgf/mm2, and tensile strength at room temperature after performing heat-treatment of 20-35 kgf/mm2. USE - Electrolytic copper foil is used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display. ADVANTAGE - The electrolytic copper foil has excellent tensile strength, uniformity and elasticity, and improve electrical property, and is suitable for mass production. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of electrolytic copper foil, which involves using an electrolytic solution.