▎ 摘　　要

NOVELTY - Wiring (100) comprises a multilayer graphene (1) including graphene sheets; an interlayer substance (2) disposed between layers of the multilayer graphene; and an organic compound layer (20) connected to a side surface of the multilayer graphene. The organic compound layer contains a photoisomerizable organic group connected to the multilayer graphene. USE - The wiring is useful as conductor in semiconductor device (e.g. integrated circuit (LSI), a central processing unit (CPU), a programmable logic device (PLD), or a memory chip) or electronic circuit. ADVANTAGE - The wiring material can have low resistance and high reliability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing wiring which involves forming a multilayer graphene processed into a wiring pattern shape on a substrate; forming an organic compound layer on a side surface of the multilayer graphene in a longitudinal direction; inserting an interlayer substance into the multilayer graphene having the organic compound layer formed in it; and cis-trans isomerizing an organic group in the organic compound layer. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective schematic diagram of wiring. Multilayer graphene (1) Interlayer substance (2) Graphene interlayer compound (10) Organic compound layer (20) Wiring (100)