• 专利标题:   High-temperature-resistant epoxy aramid fiber insulation layer and molded parts useful for engineering equipment, i.e., complex materials prepared by hot-pressing layers of high-temperature-resistant epoxy aramid fiber-fabric prepregs.
  • 专利号:   CN113354920-A, CN113354920-B
  • 发明人:   DU M, HUANG H, SHI Q
  • 专利权人:   SICHUAN EM TECHNOLOGY CO LTD
  • 国际专利分类:   C08L063/00, C08L063/04, C08L063/02, C08L077/10, C08J005/24, B29B015/10, B29C070/42, B29C070/54
  • 专利详细信息:   CN113354920-A 07 Sep 2021 C08L-063/00 202182 Pages: 24 Chinese
  • 申请详细信息:   CN113354920-A CN10555291 21 May 2021
  • 优先权号:   CN10555291

▎ 摘  要

NOVELTY - High-temperature-resistant epoxy aramid fiber insulation layer and molded parts, i.e., complex materials prepared by hot-pressing at least one layers of high-temperature-resistant epoxy aramid fiber-fabric prepregs. The high-temperature-resistant epoxy aramid fiber-fabric prepreg is formed by impregnating aramid fiber-fabric with epoxy adhesive, and then baking it to form a high-temperature-resistant aramid fiber-fabric with a semi-cured material Epoxy aramid fiber-fabric prepreg. The aramid fiber-fabric is aramid fiber checkered cloth, aramid fiber twill cloth, aramid fiber plain cloth, aramid fiber satin cloth, aramid fiber stitched felt, aramid fiber continuous felt, aramid fiber complex cloth and aramid fiber complex felt. The high temperature-resistant epoxy adhesive comprises 12-45 pts. wt. epoxy resin, 5-35 pts. wt. modified epoxy resin, 1-61 pts. wt. filler, and 6-34 pts. wt. curing agent, 9.5-201 pts. wt. solvent, and 0.01-0.18 pts. wt. accelerator. USE - The high-temperature-resistant epoxy aramid fiber insulation layer and molded parts are useful for various engineering equipment, electrical equipment, corrosion-resistant appliances, new energy vehicles, etc., which have higher requirements for temperature resistance and are used for special purposes (aerospace, aerospace, high-performance ships, bulletproof, stab-proof, military) field application, high reliability, good performance and strong practicability. DETAILED DESCRIPTION - High-temperature-resistant epoxy aramid fiber insulation layer and molded parts, i.e., complex materials prepared by hot-pressing at least one layers of high-temperature-resistant epoxy aramid fiber-fabric prepregs. The high-temperature-resistant epoxy aramid fiber-fabric prepreg is formed by impregnating aramid fiber-fabric with epoxy adhesive, and then baking it to form a high-temperature-resistant aramid fiber-fabric with a semi-cured material Epoxy aramid fiber-fabric prepreg. The aramid fiber-fabric is aramid fiber checkered cloth, aramid fiber twill cloth, aramid fiber plain cloth, aramid fiber satin cloth, aramid fiber stitched felt, aramid fiber continuous felt, aramid fiber complex cloth and aramid fiber complex felt. The high temperature-resistant epoxy adhesive comprises 12-45 pts. wt. epoxy resin, 5-35 pts. wt. modified epoxy resin, 1-61 pts. wt. filler, and 6-34 pts. wt. curing agent, 9.5-201 pts. wt. solvent, and 0.01-0.18 pts. wt. accelerator. The epoxy resin comprises bisphenol fluorene epoxy resin, bis-o-cresol fluorene epoxy resin, and/or bis-di-o-cresol fluorene epoxy resin. The modified epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, glycidylamine type epoxy resin, biphenyl type epoxy resin, phenol type phenolic ring oxygen resin, o-cresol type novolac epoxy resin, bisphenol A novolac type epoxy resin, resorcinol type epoxy resin, epoxy resin of dicyclopentadiene or dicyclodiene and phenolic type polycondensation resin, isocyanate modified epoxy resin and/or hydantoin epoxy resin. The curing agent comprises 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulfone, and/or diamine fluorene. The filler comprises aluminum hydroxide, alumina, boehmite, magnesium hydroxide, silica powder, montmorillonite, kaolin, fumed silica, silica powder, graphene, hydrotalcite, and/or talc. The accelerator is 2-methylimidazole, 2-ethyl-4-methylimidazole, N,N-dimethylbenzylamine, boron trifluoride ethylamine, triethylamine, hexamethyltetraamine, and/or aluminum acetylacetonate. The solvent is toluene, xylene, ethylene glycol dimethyl ether, ethylene glycol ethyl ether acetate, propylene glycol methyl ether, methyl ethyl ketone, cyclohexanone, methyl acetate, methyl ethyl ketone, acetone, N,N-dimethyl methyl ether amide and/or ethanol.