• 专利标题:   Prepreg for laminate used for printed circuit board comprises reinforcing material which is impregnated by thermosetting resin composition and dried in which reinforced material is graphene oxide or graphene subjected to coating process.
  • 专利号:   CN103483622-A, CN103483622-B
  • 发明人:   SU X, CHAI S
  • 专利权人:   GUANGDONG SHENGYI SCI TECH CO
  • 国际专利分类:   B32B015/092, B32B027/04, C08J005/24, C08K009/10, C08L063/00
  • 专利详细信息:   CN103483622-A 01 Jan 2014 C08K-009/10 201419 Pages: 7 Chinese
  • 申请详细信息:   CN103483622-A CN10426243 17 Sep 2013
  • 优先权号:   CN10426243

▎ 摘  要

NOVELTY - A prepreg comprises reinforcing material which is impregnated by thermosetting resin composition and dried in which reinforced material is 0.01-5 wt.% graphene oxide or graphene subjected to coating process to improve quality of graphene material. USE - A prepreg for laminate used for printed circuit board (all claimed). ADVANTAGE - Addition of reinforcing material greatly improves the mechanical property and interlayer adhesion of copper clad base plate.