▎ 摘　　要

NOVELTY - Low temperature co-fired shaping and sintering of ceramic substrate includes taking aluminum nitride, boron nitride, beryllium oxide, aluminum oxide, sintering additive, graphene nanoparticles, calcium fluoride, hydroxymethyl cellulose, deionized water, silicon powder, plasticizer, dispersant, and binder, grinding into slurry and casting to obtain ceramic blank; laminating and vacuum packaging to obtain ceramic raw blank; firing the ceramic raw blank to obtain sintered intermediate transition body; and heating and cooling to obtain the co-fired ceramic substrate. USE - Method for low temperature co-fired shaping and sintering of ceramic substrate (claimed). ADVANTAGE - The method can provide ceramic substrate having optimized physical and chemical properties. DETAILED DESCRIPTION - Low temperature co-fired shaping and sintering of ceramic substrate comprises: (A) taking 50-64 pts. wt. aluminum nitride, 30-40 pts. wt. boron nitride, 10-20 pts. wt. beryllium oxide, 30-40 pts. wt. aluminum oxide, 15-20 pts. wt. sintering additive, 2-4 pts. wt. graphene nanoparticles, 5-15 pts. wt. calcium fluoride, 3-6 pts. wt. hydroxymethyl cellulose, 15-20 pts. wt. deionized water, 5-10 pts. wt. silicon powder, 1 pts. wt. plasticizer, 1 pts. wt. dispersant, and 1 pts. wt. binder, grinding into slurry and casting to obtain ceramic blank having a thickness of less than 0.300 mm; (B) laminating the ceramic blank and vacuum packaging to obtain ceramic raw blank; punching the ceramic raw blank, using silver paste for filling hole, respectively using silver ceramic green compact group of printed circuit pattern on a top surface and a bottom surface to obtain the fired ceramic raw blank; (C) firing ceramic raw blank into furnace to carry out two-step glue discharging and obtain sintered intermediate transition body; and (D) heating the sintered intermediate transition temperature to green sintering temperature, and keeping the temperature to obtain a dense ceramic substrate; and cooling to obtain the total thickness of not greater than 0.5 mm low temperature co-fired ceramic substrate. DESCRIPTION OF DRAWING(S) - The drawing is a schematic diagram of the method for low temperature co-fired shaping and sintering of ceramic substrate (Drawing includes non-English language text).