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  • 专利标题:   Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.
  • 专利号:   CN115534475-A
  • 发明人:   CHEN M, LIU J, JIANG J
  • 专利权人:   GUANGDONG XINMEI SUPERHARD MATERIAL CO
  • 国际专利分类:   B32B027/38, B32B009/00, B32B009/04, C08K003/04, C08K009/10, C08L063/02, H05K001/03
  • 专利详细信息:   CN115534475-A 30 Dec 2022 B32B-027/38 202315 Chinese
  • 申请详细信息:   CN115534475-A CN10930233 03 Aug 2022
  • 优先权号:   CN10930233

▎ 摘　　要

NOVELTY - A thermally-conductive epoxy resin circuit board, comprises an epoxy resin insulating layer containing white graphene material. USE - Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, epoxy resin printed circuit board, epoxy resin spray-coated printed circuit board, multilayer heat-conducting epoxy resin circuit board, aluminum substrate epoxy resin coated copper-clad circuit board, aluminum substrate epoxy resin printed circuit board and aluminum substrate epoxy resin sprayed printed circuit boards (all claimed) used as LED light source component and power components. ADVANTAGE - The circuit board has increased thermal conductivity in thickness direction of 14.301 (W/m.K) than the existing aluminum substrate epoxy resin copper-clad circuit board and heat-dissipation.